[4-(2,3,4-trihydroxybenzoyl)phenyl] 6-(diazenyldiazenyl)-5-oxo-8H-naphthalene-1-sulfonate

Base Information

• Chemical Name: [4-(2,3,4-trihydroxybenzoyl)phenyl] 6-(diazenyldiazenyl)-5-oxo-8H-naphthalene-1-sulfonate
• CAS No.: 68510-93-0
• Deprecated CAS: 107853-40-7,109766-97-4,110120-21-3,114355-52-1,68389-54-8,88160-02-5,1623136-76-4,1779506-07-8
• Molecular Formula: C13H10O4^.x(C10H6N2O4S)
• Molecular Weight: 508.4601
• Mol file: 68510-93-0.mol

Synonyms:[4-(2,3,4-trihydroxybenzoyl)phenyl] 6-(diazenyldiazenyl)-5-oxo-8H-naphthalene-1-sulfonate;EINECS 270-931-7;SCHEMBL17501897;W-111358;1-Naphthalenesulfonic acid, 6-diazo-5,6-dihydro-5-oxo-, ester withphenyl(2,3,4-trihydroxyphenyl)methanone

Chemical Property of [4-(2,3,4-trihydroxybenzoyl)phenyl] 6-(diazenyldiazenyl)-5-oxo-8H-naphthalene-1-sulfonate

Chemical Property:

• Vapor Pressure: 9.65E-26mmHg at 25°C
• Refractive Index: 1.731
• Boiling Point: 787.5 °C at 760 mmHg
• Flash Point: 430.1 °C
• PSA: 335.70000
• Density: 1.62g/cm³
• LogP: 8.34718
• XLogP3: 5.6
• Hydrogen Bond Donor Count: 4
• Hydrogen Bond Acceptor Count: 12
• Rotatable Bond Count: 7
• Exact Mass: 508.06888465
• Heavy Atom Count: 36
• Complexity: 1020

Purity/Quality:

99.9% ^*data from raw suppliers

2,3,4-TRIHYDROXYBENZOPHENONE NAPHTHOQUINONE-1,2-DIAZIDO-5-SULFONATE 95.00% ^*data from reagent suppliers

Safty Information:

• Pictogram(s):  
• Hazard Codes: 

MSDS Files:

SDS file from LookChem

Useful:

• Canonical SMILES: C1C=C(C(=O)C2=C1C(=CC=C2)S(=O)(=O)OC3=CC=C(C=C3)C(=O)C4=C(C(=C(C=C4)O)O)O)N=NN=N
• Use Description: 2,3,4-Trihydroxybenzophenone naphthoquinone-1,2-diazido-5-sulfonate is a chemical compound with specific applications in the field of photolithography and photoresists. In this field, it plays a crucial role as a photosensitive compound used in the fabrication of microelectronics and microelectromechanical systems (MEMS). This compound is incorporated into photoresist materials, which are essential for defining patterns on semiconductor wafers during the photolithography process. When exposed to ultraviolet (UV) light, it undergoes a photochemical reaction, leading to the creation of intricate patterns on the photoresist-coated substrate. These patterns serve as templates for subsequent etching or deposition steps in the semiconductor manufacturing process, enabling the precise construction of integrated circuits and microscale devices. Its significance lies in its ability to enable high-resolution patterning in the semiconductor industry, advancing the development of electronic devices and microfabrication technologies.