Phosphoric acid (potassium)

Base Information

• Chemical Name: Phosphoric acid (potassium)
• CAS No.: 7778-77-0
• Molecular Formula: KH2PO4
• Molecular Weight: 136.08
• Hs Code.: HOSPHATE PRODUCT IDENTIFICATION
• Mol file: 7778-77-0.mol

Synonyms:Phosphoric acid (potassium);PJNZPQUBCPKICU-UHFFFAOYSA-N;Potassium phosphate monobasic, 99.0%;Potassium phosphate monobasic, >=99.5%;Potassium phosphate monobasic, LR, >=98%;Potassium phosphate monobasic, ReagentPlus(R);Potassium phosphate monobasic, NIST SRM 2186I;Potassium phosphate monobasic, AR, 99.5-100.5%;Potassium phosphate monobasic, USP, 98.0-100.5%;Potassium dihydrogen phosphate, NIST(R) SRM(R) 200b;Potassium phosphate monobasic, ACS reagent, >=99.0%;Potassium phosphate monobasic, for HPLC, 99.5-100.5%;Potassium phosphate monobasic, 99.99% trace metals basis;Potassium phosphate monobasic, JIS special grade, >=99.0%;Potassium phosphate monobasic, SAJ first grade, >=99.0%;Potassium phosphate monobasic, for molecular biology, >=98.0%;Potassium phosphate monobasic, Vetec(TM) reagent grade, 99%;Potassium phosphate monobasic, plant cell culture tested, >=99%;Potassium phosphate monobasic, p.a., ACS reagent, reag. ISO, 99.5%;Potassium phosphate monobasic, suitable for oxidant determination, >=99.0%;Potassium phosphate monobasic, tested according to Ph.Eur., anhydrous;Monobasic potassium phosphate, United States Pharmacopeia (USP) Reference Standard;Potassium phosphate monobasic, anhydrous, free-flowing, Redi-Dri(TM), ACS reagent, >=99%;Potassium phosphate monobasic, BioUltra, for molecular biology, anhydrous, >=99.5% (T);Monobasic Potassium Phosphate, Pharmaceutical Secondary Standard;Certified Reference Material;Potassium phosphate monobasic, anhydrous, free-flowing, Redi-Dri(TM), ReagentPlus(R), >=99.0% (titration);Potassium phosphate monobasic, buffer substance, anhydrous, puriss. p.a., ACS reagent, reag. ISO, reag. Ph. Eur., 99.5-100.5%;Potassium phosphate monobasic, powder, suitable for cell culture, suitable for insect cell culture, suitable for plant cell culture, >=99.0%;Potassium phosphate monobasic, TraceCERT(R), certified reference material, 31P-qNMR Standard

Chemical Property of Phosphoric acid (potassium)

Chemical Property:

• Appearance/Colour: white powder
• Melting Point: 252.6 °C(lit.)
• Boiling Point: 158oC at 760 mmHg
• PSA: 90.40000
• Density: 2.338 g/mL at 25 °C(lit.)
• LogP: -0.49040
• Water Solubility.: 222 g/L (20℃)
• Hydrogen Bond Donor Count: 3
• Hydrogen Bond Acceptor Count: 4
• Rotatable Bond Count: 0
• Exact Mass: 136.94060206
• Heavy Atom Count: 6
• Complexity: 49.8

Purity/Quality:

98% ^*data from raw suppliers

Safty Information:

• Pictogram(s): F,T,C,Xi
• Hazard Codes: F,T,C,Xi
• Safety Statements: S24/25:

MSDS Files:

SDS file from LookChem

Total 1 MSDS from other Authors

Useful:

• Canonical SMILES: OP(=O)(O)O.[K]
• Physical and Optical Properties: Frequency-Doubling: KDP exhibits frequency-doubling properties.; Nonlinear Conversion: It shows high efficiency in nonlinear conversion.; Phase Matching: KDP allows easy phase matching.; Photoelectric and Piezoelectric Capabilities**: It possesses excellent photoelectric and piezoelectric capabilities.; Transparency: KDP offers superior transparency over a wide spectral range.; Optical Uniformity: It demonstrates outstanding optical uniformity.
• Uses: Optical Communication and Signal Processing: KDP finds wide usage in optical communication and signal processing.; Laser Ignition of Inertial Confinement Fusion (ICF): Its rapid growth technology enables the production of large aperture KDP, making it indispensable for laser ignition in ICF.; Nonlinear Optical Material: KDP is a promising nonlinear optical material with a wide light transmission band, superior laser damage resistance, large non-linear coefficient, and electro-optic coefficient. It is extensively used in high-power laser and nuclear fusion systems.
• Processing Challenges: Softness, Heat Sensitivity, and Water Solubility: KDP is recognized as one of the most challenging materials to process due to its softness, heat sensitivity, and water solubility.; Surface and Subsurface Damage: Processing technologies often result in surface and subsurface damage, limiting its applications.; Planarization Techniques: Chemical Mechanical Polishing (CMP) is considered an excellent means of planarization to reduce surface roughness and damage.; Challenges in CMP: Water-based polishing slurry used in CMP poses difficulties due to KDP's deliquescence characteristics. Researchers are exploring micro-water polishing techniques to minimize water's detrimental effects. However, achieving extremely low surface roughness remains challenging.